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SMD2018貼片自恢復(fù)保險(xiǎn)絲



Performance Specification                                                  

Model

 

V max

 

(V dc)

 

Imax

 

(A)

 

I hold

@25°C

(A)

 

I trip

@25°C

(A)

 

Pd

Typ.

(W)

Maximum

Time To Trip

Resistance

Current

(A)

Time

(Sec)

R i min

(W)

R1max

(W)

SMD2018-030SF

60

10

0.30

0.60

0.9

1.5

3.00

0.500

2.300

SMD2018-050SF

60

10

0.55

1.20

1.0

2.5

3.00

0.200

1.000

SMD2018-075SF

60

10

0.75

1.50

1.1

8.0

0.30

0.110

0.630

SMD2018-100SF

15

35

1.10

2.20

1.1

8.0

0.40

0.060

0.360

SMD2018-100SF33V

33

35

1.10

2.20

1.1

8.0

0.40

0.060

0.360

SMD2018-150SF

15

35

1.50

3.00

1.1

8.0

0.80

0.050

0.170

SMD2018-200SF

10

35

2.00

4.00

1.1

8.0

2.40

0.030

0.100

       V max  = Maximum operating voltage device can withstand without damage at rated current (Imax).

       I max   = Maximum fault current device can withstand without damage at rated voltage (V max).

       I hold   = Hold Current. Maximum current device will not trip in 25°C still air.

       I trip    = Trip Current. Minimum current at which the device will always trip in 25°C still air.

       Pd      = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

       Ri min/max  = Minimum/Maximum device resistance prior to tripping at 25°C.

       R1max  = Maximum device resistance is measured one hour post reflow.

       CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.


Environmental Specifications                                                

Test

 

 

 

Conditions

 

 

 

Resistance change

Passive aging

 

 

 

+85°C, 1000 hrs.

 

 

±5% typical

 

 

Humidity aging

 

 

 

+85°C, 85% R.H. , 168 hours

 

±5% typical

 

 

Thermal shock

 

 

 

+85°C to -40°C, 20 times

 

 

±33% typical

 

Resistance to solvent

 

 

 

MIL-STD-202,Method 215

 

 

No change

 

 

Vibration

 

 

 

MIL-STD-202,Method 201

 

 

No change

 

 

Ambient operating conditions : - 40 °C to +85 °C

Maximum surface temperature of the device in the tripped state is 125 °C



Thermal Derading Chart                                                   

       Recommended Hold Current(A) at Ambient Temperature(°C)

Model

Ambient Operation Temperature

-40°C

-20°C

0°C

25°C

40°C

50°C

60°C

70°C

85°C

SMD2018-030SF

0.48

0.42

0.35

0.30

0.24

0.21

0.17

0.15

0.10

SMD2018-050SF

0.87

0.77

0.67

0.55

0.46

0.41

0.36

0.31

0.23

SMD2018-075SF

1.19

1.05

0.91

0.75

0.61

0.54

0.47

0.41

0.32

SMD2018-100SF

1.71

1.52

1.32

1.10

0.94

0.84

0.74

0.64

0.50

SMD2018-150SF

2.38

2.10

1.82

1.50

1.27

1.13

0.99

0.85

0.64

SMD2018-200SF

2.95

2.65

2.35

2.00

1.74

1.59

1.44

1.29

1.06


Thermal Derating Curve                                                   

      

Average Time-Current Curve                                                 

      

Soldering Parameters                                                     

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate(Ts max to T p)

3℃/second mac.

Preheat

  -Temperature Min(Ts min)

  -Temperature Max(Ts max)

  -Time(Ts min to Ts max)

 

150℃

200℃

60~180 seconds

Time maintained above:

  -Temperature(TL)

  -Time(tL)

 

217℃

60~150 seconds

Peak Temperature(Tp)

260℃

Ramp-Down Rate

6℃/second max.

Time 25℃ to Peak Temperature

8 minutes max

Storage Condition

0℃~30℃,30%~60%RH

 

      Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free

      Recommended maximum paste thickness is 0.25mm

      Devices can be cleaned using standard industry methods and solvents.

      Note 1:All temperature refer to topside of the package, measured on the package body surface.

      Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

   

 

 


Physical Dimensions(mm.)                                                 

            

Model

A

B

C

D

E

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Min.

SMD2018-030SF

4.72

5.44

4.22

4.93

0.50

1.20

0.30

0.25

SMD2018-050SF

4.72

5.44

4.22

4.93

0.50

1.20

0.30

0.25

SMD2018-075SF

4.72

5.44

4.22

4.93

0.50

1.20

0.30

0.25

SMD2018-100SF

4.72

5.44

4.22

4.93

0.50

1.20

0.30

0.25

SMD2018-100SF33V

4.72

5.44

4.22

4.93

0.50

1.20

0.30

0.25

SMD2018-150SF

4.72

5.44

4.22

4.93

0.50

1.20

0.30

0.25

SMD2018-200SF

4.72

5.44

4.22

4.93

0.50

1.20

0.30

0.25

       Termination Pad Characteristics

       Terminal pad materials：Tin-plated Nickel-Copper

       Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.


Recommended Pad Layout (mm.)                                          

      


Tape And Reel Specifications (mm)                                         

Governing Specifications

EIA 481-1

W

 

12.0 ± 0.2

P0

 

4.0 ± 0.10

P1

 

8.0 ± 0.10

P2

 

2.0 ± 0.05

A0

 

4.40 ± 0.10

B0

 

5.50 ± 0.10

B1max.

 

8.20

D0

 

1.50 + 0.1, -0

F

 

5.5 ± 0.05

E1

 

1.75 ± 0.10

E2min.

 

10.25

T

 

0.6

T1max.

 

0.1

K0

 

1.36 ± 0.1

Leader min.

 

390

Trailer min.

 

160

Reel Dimensions

 

A max.

 

178

N min.

 

50

W1

 

12.4 ± 0.5

W2

 

18.4 ± 0.5

 

 

 

Storage And Handling

? Storage conditions：0℃~30℃, 30%~60% R.H.

? Devices may not meet specified performance

  if storage conditions are exceeded.







 

 Part Number System                                                      

SMD 2018 - 口口口 S F 口口V
                                           special voltage Rating(Optional)

                                           Lead-Free

                                           Tin-plated Nickel-Copper

                                           Holding Current Rating

                                           

                                           Device Dimensions: Length/width(Unit:1/100 inch) Size 5045 mm / 2018 inch

                                           Surface Mount Device

 

 


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